LeEco To Launch Le Pro 3 In China On September 21
Chinese smartphone maker LeEco is set to launch its long awaited flagship phone Le Pro3 on 21 September in an event scheduled to be held in China. The device is reportedly 7mm thick and will have high end hardware features. The device is an advanced version of Le Max 2 and made of an all-metal build body.
The phone may reportedly feature a Qualcomm Snapdragon 821 processor clubbed with 6GB of RAM and 64GB of internal memory. Its storage capacity can be expanded via microSD card slot. On optics front, the Le Pro3 may have 16-megapixel rear camera under the hood and an 8-megapixel camera on the front. The phone will come packed with a massive 5,000mAh battery.
The specs clearly show that the phone will be a tightly packed device with massive hardware configurations. However, there are absolutely no clues about the price and availability of 3.5mm audio jack with the device. .
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